您当前浏览器版本过低,为了不影响您的使用,建议您使用最新的谷歌浏览器、火狐浏览器、 360浏览器,更换浏览器后使用更流畅!(注意!双核浏览器请切换为极速模式)
400-607-9388

2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)

2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
Date:2023/10/28 09:00-2023/11/02 18:00
Venue:San Francisco

2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)

2023年IEEE/ACM计算机辅助设计国际会议(ICCAD)


Important Dates:

Paper Submission Deadline:May 15, 2023

Notification of Acceptance:July 21, 2023

Date of the meeting:October 28 - November 2, 2023

Location: San Francisco, California, USA


Conference introduction:

Jointly sponsored by IEEE and ACM, ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. ICCAD covers the full range of CAD topics – from device and circuit level up through system level, as well as post-CMOS design. ICCAD has a long-standing tradition of producing cutting-edge, innovative technical program for attendees.


 Organizing Committee:


image.png


Call for Papers:

Original technical submissions on, but not limited to, the following topics are invited:


1.1 System Design

System-level specification, modeling, simulation, design flaws

System-level issues for 3D integration

System-level design case studies and applications

HW/SW co-design co-simulation, co-optimization, and co-explorationplatforms for emulation and rapid prototyping

Micro-architectural transformation

Multi-/many-core processor, GPL and heterogeneous SoC

Memory and storage architecture and system synthesis

System communication architecture, Network-on-chip design

Modelinqsimulation high-level synthesis power/performanceanalysis, programming of heterogeneous computing platforms

Application driven system design for big data

Analysis and optimization of data centers


1.2 Embedded, cyber-Physical (CPS), loT Systems

and S oftware

Al and machine learning for embedded systems

HW/SW codesign for embedded systems

Compute memory,storage interconnect for embedded systems

Domain-specific accelerators

Energy/power management and energy harvesting

Real-time software and systems

Middleware virtual machines, and runtime support

Dependable safe secure trustworthy embedded svstems

Embedded software: compilation, optimization, testing

CAD for loTedge and fog computing

Modelinganalysis verification of CPS systems

Green computing (smart grid, energy, solar panels, etc.)

CAD for application domains including wearables, health careautonomous systems smart cities


1.3 Tools and Design Methods with and for Artificia!Intelligence(AD

Compilers for deep neural networks

Design method for learning on a chip

Deep neural network for EDA

Tools and design methodologies for edge Al and TinyML

Performance analysis and modeling for Al accelerators

Reliability analysis for neural network designs


Contact Us:

Authors can scan the code to add conference teachers and send IEEE for submission consultation咨询销售-廖舒淇.png




Recent participants
No data, go register for a conference and submit your paper
Conference knowledge
more
期刊有什么用
期刊有什么用?期刊作为学术研究和专业实践中的重要出版物,扮演着多种关键角色,对个人学者、专业领域以及广泛的学术社区都有着重要的影响和用途。
如何参加专业学术会议
如何参加专业学术会议?参加学术会议对常见的一种学术交流方式,国内国际都会定期举办一些学术会议,吸引各界学术人员进行参加,参会人员也可以安排自己的论文,含金量高的论文也可能被EI数据库收录,下面学术顾问具体分享参加学术会议的渠道有哪些?
如何判别学术会议等级
如何判别学术会议等级?高校教师和研究生每天都会收到大量学术会议通知和投稿征文通知。当然,很多会议都不是免费的。有些人不明就里,出于好奇或冲动而投稿,造成论文的版权被“没用的”会议占有而无法向“有用的”会议或期刊继续投稿,而且还耗费大量会议费和差旅费,经常后悔晚矣。那么,什么是没用的会议?什么是有用的会议?本文就此阐述如何判别学术会议等级。
如何设计学术会议海报
如何设计学术会议海报?在参加学术会议的时候,制作一份会议海报来展示你的研究内容是十分必要的。海报是你与别人交流研究成果时的关键部分,也是成功科研生涯的重要元素。海报本身自带许多优秀的特质:思路清晰、内容精练,并且极易引起他人的兴趣。

Popular recommendation

绘图

Course

ISF

Conference

本站由: 提供技术支持 [ 筹办会议 ]
2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
发送
Baidu
map